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UPILEX-S - Ube ultra-High Heat-Resistant Polyimide Film
 UPILEX, the ultra-high heat-resistant polymide film, is the product of the polycondensation reaction between biphenyltetracarboxylic dianhydride (BPDA), of which porcess Ube Industries originally developed, and diamine. Thanks to its outstanding characteristics over a wide temperature range, UPILEX has been the subject of much attention as a new material for use in the electronics and other leading-edge industries. Most notable of these characteristics is UPILEX's unbeatable physical, mechanical, electrical, and chemical properties under high-temperature conditions. In each of these areas, UPILEX is far superior to the competition, as an ultra-high heat-resistant polyimide film that will continue to fulfill the strictest requirements.
Mechanical Properties
As mentioned previously, UPILEX-S demonstrates outstanding mechanical characteristics through a wide temperature range. UPILEX-S displays high tensile strength and modulus, and also features outstanding long-term heat resistance. Another advantage inherent in UPILEX-S is its high resistance to hydrolysis, as its properties are practically unaffected, even by immersion in boiling water for long periods of time.
Table-1 Mechanical Properties | Properties | Unit | Typical Values | Test Method | | UPILEX-25S(25µm) | UPILEX-75S(75µm) | | -269°C | -196°C | 25°C | 300°C | 25°C | 200°C | | Tensile Strength (MD) | MPa | 735 | 647 | 520 | 290 | 360 | 270 | ASTM D882 | | Stress at 5% Elongation (MD) | MPa | --- | --- | 260 | 90 | 210 | 110 | ASTM D882 | | Elongation (MD) | % | 10 | 15 | 42 | 67 | 50 | 80 | ASTM D882 | | Tensile Modulus (MD) | MPa | --- | --- | 9100 | 3700 | 6900 | 3800 | ASTM D882 | | Tear Strength-Initiation [Graves] (MD) | N | --- | --- | 230 | --- | 290 | --- | ASTM D1004 | | Tear Strength-Ipropagation [Elmendorf] (MD) | N | --- | --- | 3.2 | --- | 4.2 | --- | ASTM D1922 | | Folding endurance [MIT] | Cycles | --- | --- | >100,000 | --- | >25,000 | --- | ASTM D2176 | | Density | X 103kg/m3 | --- | --- | 1.47 | --- | 1.47 | --- | ASTM D1505 | | Coefficient of Kinetic Friction (film-to-film) | --- | --- | --- | 0.4 | --- | 0.4 | --- | ASTM D1894 | | *MD: Machine Direction |
Electrical properties
UPILEX-S exhibits excellent electrical characteristics over a wide range of temperatures and frequences. Even at high temperatures, UPILEX-S shows remarkably slight deterioration in its electrical properties.
Table-2 electrical Properties | Properties | Unit | Typical Values | Test conditions | Test Method | | UPILEX-25S | UPILEX-75S | | 25°C | 200°C | 25°C | 200°C | | Dielectric Strength | kV | 6.8 | 6.8 | 11 | 11 | 50Hz | ASTM D149 | | Dielectric Constant | --- | 3.5 | 3.3 | 3.3 | 3.2 | 103 Hz | ASTM D150 | | Dissipation Factor | --- | 0.0013 | 0.0078 | 0.0038 | 0.0056 | 103 Hz | ASTM D150 | | Volume Resistivity | Ω - m | 1015 | 1013 | 1014 | 1014 | DC100V | ASTM D257 | | Surface Resistivity | Ω | >1017 | 1015 | >1016 | 1015 | DC100V | ASTM D257 |
Thermal Properties
UPILEX-S boasts the highest heat resistance of any plastic film currently available. Its major features include smaller values in both heat shrinkage and thermal linear expansion coefficients, and self-extinguishing (UL94 VTM-0). This makes it ideal for use in FPC and TAB-tape substrates composed of mninute circuits.
Table-3 Thermal Properties | Properties | Typical Values | Test Conditions (Test Method) | | UPILEX-25S | UPILEX-75S | | Heat shrinkage (%) | 0.1 | 0.01 | 200°C, 2HoursASTM D1204 | | Thermal Linear Expansion Coeficient (ppm/K) | 20 - 200°C | 12 | 20 | Values determined by minute linear expansion tester at 5°C/min. temperature increments | | Melting Point (°C) | None | | | Specific Heat kJ(kg·K) | 1.13 | Differential ScanningCalorimeter | | Temperature Index (°C) | 290 | Heat Treatment: 20,000Hours | | Flammability | UL94 VTM-0 (Exceeding 7.5µm) | UL94 File No.48133 | | Oxygen Index (%) | 66 | JIS K7201 | | Thermal Conductivity (W/(m·K) | 0.290 | Laser Flash Method |
Chemical-Resistant Properties
UPILEX-S is insoluble in all organic soluvents, and is sufficiently resistant to virtually any chemicals, including inorganic acid and alkali solution and so forth. UPILEX-S retains its pysical properties and superior dimensional stability even when exposed to chemicals.
Table 4-1 Chemical Properties | Properties | Typical Values [25µm Film] (%) | Test Conditions | Test Method | | Strength Retained | Elongation Retained | Modulus Retained | | Resistanceto: | | | 10% Sodium Hydroxide | | | Glatial AceticAcid | | | Water | PH=1.0 | | | | PH=4.2 | | | | PH=8.9 | | | | PH=10.0 | | | | | | | | | | | Immersion at25°Cfor 5 days | | Immersion at110°Cfor 5 weeks | | Immersion at100°Cfor 2 weeks | | Immersion at100°Cfor 2 weeks | | Immersion at100°Cfor 2 weeks | | Immersion at100°Cfor 4 days |
| ASTM D882 | | Water Absorption | | | Immersion inwater at 23°C for 24 hours | | Equilibrium at60%RH, 50°C | | ASTM D570 | | Gas Permeability | | | Water Vapor | | | Oxygen | | | Carbon Dioxide |
| | | | | | | 1.7X10-3kg/m2/25µm | | 0.8X10-6m3/m2/25µm | | 1.2X10-3m3/m2/25µm |
| | | | | | | | | | | At 38°C, 90%RH for 24 Hours |  | At 30°C, 1 atm for 24 Hours |
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Table 4-2 Dimensional Stability WhenImmersed in Various Chemical Solutions and Solvents .(Unit:%) | Chemicals | Typical Values [25µm Film] | Immersion Conditions | | MD | TD | | Ferric Chloride (37%) | - 0.01 | +0.01 | At room Temperature for 10 minutes | | Cupric Chloride (37%) | +0.01 | - 0.01 | At room Temperature for 10 minutes | | 5% Sodium Hydroxide | - 0.02 | +0.03 | At 60°C for 30 minutes | | Isopropanol | - 0.00 | +0.01 | At room Temperature for 10 minutes | | Methyl Ethyl Ketone | - 0.01 | - 0.00 | At room Temperature for 10 minutes | | Methylene Chloride/Trichloroethane(Mixed) | - 0.00 | +0.00 | At room Temperature for 10 minutes | | 2N-Hydrochloric Acid | - 0.00 | - 0.00 | At room Temperature for 10 minutes | *MD = Machine Direction | TD = Transverse Direction |
Environmental Resistance
UPILEX-S features low water absorption and hygroscopic expansion. another advantage inherent in UPILEX-S is its low absorption/desorption speeds and superior weather resistance.
General Properties of Various Heat Resistant Films | Properties | Unit | UPILEX-S | Conventional
Polymide | Polyester | Polysulfone | Polytetrafluooethylene | | Density | g/cm3 | 1.47 | 1.42 | 1.38 - 1.41 | 1.24 - 1.25 | 2.1 - 2.2 | | Tensile Strength | MPa | 520 | 173 | 137 - 245 | 58 - 74 | 11 - 31 | | Elongation | % | 42 | 70 | 60 - 170 | 60 - 110 | 100 - 400 | | Tensile Modulus | MPa | 9120 | 2961 | --- | --- | --- | | Tear Strength-Initiation (Graves) | N | 226 | 197 | 177 - 530 | 39 | --- | | Tear Strength-Propagation | N | 3.24 | 3.14 | 4.90 - 10.79 | 3.92 - 4.90 | 3.92 | | Resistance to Organic Solvents | --- | Excellent | Excellent | Excellent | Excellent | Excellent | | Resistance to Strond Acids | --- | Good | Good | Good | Excellent | Excellent | | Resistance to Strong Alkalis | --- | Good | Inferior | Good | Excellent | Excellent | | Dielectric Constant | --- | 3.5 | 3.5 | 3.2 | 3.1 | 2.1 | | Dissipation Factor | --- | 0.0013 | 0.003 | 0.005 | 0.0008 | 0.0002 |
UPILEX-S Grades and Area Factors | Type | Grade | Thickness (µm) | Width (mm) | Area Factor (m2/kg) | | UPILEX-S | 7.5SN | 7.5 | 508/1016 | 90.4 | | 12.5SN | 12.5 | 508/1016 | 54.4 | | 25S | 25 | 508/1016 | 27.2 | | 50S | 50 | 508/1016 | 13.6 | | 75S | 75 | 508/1016 | 9.1 | | 125S | 125 | 508/1016 | 5.4 |
1. Statement Content
The statement content is based on materials, data and informationcurrently available and no guarantee is made with regard to content, physical properties or hazards and harmful effects. Furthermore, as handing precautions relate to normal handling, in cases of special handling, safety measures appropriate to the application and its method should ba taken.
2. Handling Precaustions
- When handling UPILEX-S at high temperatures attention should be paid to ventilation. This is because DMAC, of which UPILEX-S contains traces, produces carbon monoxide at temperatures greater thatn 300°C and at high temperatures, in excess of 500°C, UPILEX-S generates pyrolytic products. Ventilation should be adequate to ensure that concentrations of DMAC and carbon monoxide are kept to safe levels(10ppm and 100ppm). In addition, breathing safety equipment, such as organic gasmasks, should be used to prevent the inhalation of fumes.
- As data relating to health and the natural environment are incomplete, the greatest caution should be exercised when handling UPILEX-S.
- When disposing of UPILEX-S, the material should be burned in an appropriate incinerator as there is concern about environmental pollution. This should be done in accordance with atmospheric pollution prevention laws.
- Please read the material safety data sheet(MSDS) before use. If you have not received a MSDS, please request one from the company.
3. Fire Measures
Fires should be extinguished with powder, carbon dioxide, foam fire exinguishers or water sprays.
4. emergency measures
- If UPILEX-S enters the eye, particles should be flushed out thoroughly and immediately with clean water. If the eye becomes bloodshot or exhibits any other abnormality, medical assistance should be sought.
- In case of contact with the skin, the affected area should be washed with soap and large quantities of water. If irritation persists, medical advice should be sought.
- If swallowed, induce vomiting, wash the mouth and seek medical attention.
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