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Polymide Base Copper Clad Laminate (Adhesiveless) - UPISEL®-N
| ♦ | UPISEL-N is non-adhesive type flexible Copper Clad Laminate based on "UPILEX-VT." | | ♦ | UPISEL-N has excellent dimensional stability and heat resistance. | | ♦ | "UPILEX-VT" performs high bonding ability without any use of adhesives by simple heat lamination. | | ♦ | "UPILEX-VT" is an aromatic polyimide same as "UPILEX-S" which has high market share as the base film for TAB (Tape Automated Bonding). |
UPISEL-N Board Structure
Double-side Type
Single-side Type
Characteristics
| ♦ | Without the use of adhesives, UPISEL-N maintains high physical properties and high reliability at high temperatures. | | ♦ | It performs excellent peeling strength, heat soldering resistance, chemical resistance and dimensional stability. | | ♦ | The film layer of the UPISEL-N can be heat bonded with ceramics, metals and silicon chip. | | ♦ | Without the use of adhesives, UPISEL-N is tender for the environment. |
Application
FPC, TCP, MCM-L, COF, Rigid flex, Malti-layer boards, Metal based boards, High frequency boards, Heat-resistant boards, IC cards, Boards for automobile, Electromagnetic wave shield material and HDD suspension.
UPISEL-N Properties *1 Test Grade: BE1210(Polyimide = 25µm, Cu = 18µm) | Item | Test Condition | Typical Values*1 | Test Method | | Copper Foil
Peel
Strength | State | Width | Peel | Unit | | | | Normal | 3.2w | 90°C Peel | kg/cm | 1.1 | IPC-FC-
241B | | Heat
Condition | 25°C | 10w | T Peel | kg/cm | 1.4 | | 250°C | 10w | T Peel | kg/cm | 1.3 | | 300°C | 10w | T Peel | kg/cm | 0.7 | | After 200°C x 7days | 10w | 90°C Peel | kg/cm | 1.1 | | Chemical
Resistance | 2N-HC | 3.2w | 90°C Peel | Retained % | 100 | | 2N-NaOH | 3.2w | 90°C Peel | Retained % | 100 | | Dimensional
Stability | After Cu Etching | MD | Change Ratio
% | -0.060 | | TD | -0.025 | | After Heating 150°Cx 30min. | MD | Change Ratio
% | -0.080 | | TD | -0.035 | | Flexural Endurance | MD | Cycle | 110,000 | | TD | 150,000 | | Hot Solder Resistance: 300°C1min. | No Change | | Folding EnduranceRO.4 | MD | Cycle | 48 | JPCA
FC01 | | TD | 48 | | Volume Resistivity | Ω°Cm | >5 x 1016 | ASTM
D257 | | Surface Resistivity | Ω | >1 x 1014 | | Dielectric Constant (1kHz) | -- | 3.2 | ASTM
D150 | | Dissipation Factor (1kHz) | -- | 0.0023 | | Dielectric Strength | kV/25m | 5 | D149 | | Tensile Eltongation | % | 54 | ASTM
D882 | | Tensile Modulus | kg/mm2 | 680 | | Water Absorption Rate | % | 1 | IPCTM
650 | | Flammability | -- | 94 VTM-0 | UL94 |
UPISEL®-N Grades
Grade No. Table | Copper Foil | Type | Polyimide Thickness | | Type | Thickness | 15µm | 25µm | 50µm | Electrolytlc
Copper Foil | 35µm | Double | BE1105 | BE1110 | BE1120 | | Single | SE1105 | SE1110 | SE1120 | | 18µm | Double | BE1205 | BE1210 | BE1220 | | Single | SE1205 | SE1210 | SE1220 | | 12µm | Double | BE1305 | BE1310 | BE1320 | | Single | SE1305 | SE1310 | SE1320 | | 9µm | Double | BE1405 | BE1410 | BE1420 | | Single | SE1405 | SE1410 | SE1420 | | Rolled Copper Foil | 35µm | Double | BR1105 | BR1110 | BR1120 | | Single | SR1105 | SR1110 | SR1120 | | 18µm | Double | BR1205 | BR1210 | BR1220 | | Single | SR1205 | SR1210 | SR1220 | | 12µm | Double | BR1305 | BR1310 | BR1320 | | Single | SR1305 | SR1310 | SR1320 |
UPISEL®-N Standard size (mm)
| 500 x 500 | 500 x 250 | 250 x 250 |
UPISEL® Family
| UPISEL®-C | Stainless Steel Laminate | | UPISEL®-K | Metal-Base Copper Clad Laminate | | UPISEL®-H | Large Thermal Conductivity Type | | UPISEL®-D | Copper Thin Deposited Polyimide |
1. Statement Content
The statement content is based materials, data and information currently available and no guarantee is made with regard to content, physical properties or hazards and harmful effects. Furthermore, as handling precautions relate to norrnal handling, in case of special handling, safety measures appropriate to the application and its method should be taken.
2. Handling Precautions
*When handling UPISEL® at high tenperatures attention should be paid to ventilation. This is because DMAC, of which UPISEL® contains traces, produces carbon monoxide at temperatures greater than 300°C and at high temperatures, in excess of 500°C, UPISEL® generates pyrolytic products. Ventilaion should be adequate to ensure that concentrations of DMAC and carbon monoxide are kept to safe levels (l0ppm and l00ppm). In addition, breathing safety equipment, such as organic gasmasks, should be used to prevent the inhalation of fumes.
*As data relating to health and the natural environment are incomplete, the greatest caution should be exercised when handing UPISEL®.
*When disposing of UPISEL®, the material should be burned in an appropriate incinerator as there is concern about environmental pollution. This should be done in accordance with atmospheric pollution prevention laws.
*Please read the material safety data sheet(MSDS) before use. If you have not received a MSDS, please request one from the company.
3. Fire Measures
Fires should be extinguished with powder carbon dioxide, foam fire extinguisher or water sprays.
4. Emergency Measures
Eye contact: Take a piece out of eyes quickly, and wash eyes by clean water sufficiently. If bloodshot eyes or other respiratory symptom develop, consult medical personnel.
Skin contact: Wash your hands with a great deal of water and soap. If you feel stimulus, consult medical personnel.
Swallow: Vomit it and wash mouth and consult medical personnel.
5. Others
The product is for industrial use only. If your company use for medical and other special use which you must take safety into consideration, determination of suitability and safety of the finished product shall be the responsibility of your company. Don't plant and inject the material and don't use the product in case it is possibility that a part of the product remains in the human's body.
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